Welcome To ICECCME 2023

* The conference will be hybrid mode. You can present your paper physically or online.

The 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) is the premier event that brings together industry professionals, academics, and engineers from the related institutions to exchange information and ideas on electrical, computer, communications and mechatronic engineering. The conference will feature a comprehensive technical program offering numerous technical sessions with papers showcasing the latest technologies, and applications. This event is being organised with the collaboration of ULL and DESAL+ LIVING LAB in the framework of E5DES project (85% ERDF cofunding – MAC programme).

All submissions will be subject to double-blind reviews and accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. IEEE Conference record number: 57830


The topics of the conference include (but are not limited to):

  • Electrical Energy Generation, Transmission and Distribution
  • Renewable Energy Systems
  • Solar Technology
  • Electrical Machines
  • Power Electronics
  • Computer Vision
  • Artificial Intelligence
  • Computer Networks
  • Big Data
  • Signal Modelling for Audio-Visual Communication
  • Machine Learning
  • Telecommunication Systems
  • Desalination
  • Data Mining
  • Digital Communication Systems
  • Fiber-optic Communication
  • Mechatronics Engineering
  • Advanced Manufacturing
  • Intelligent Control
  • Micro Mechatronics
  • Mechatronics in Energy Systems
  • Fault Detection and Diagnosis in Mechatronics Systems
  • IoT and sensor networks
  • Robotics and automation
  • Engineering applications supporting the SDGs

All paper submissions will be double-blind peer reviewed and evaluated based on originality, research content, correctness, relevance to conference and readability. Please read complete call for papers guidelines before submitting your paper.

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